Electronics Cooling Designs: Heat Sinks
Heat sinks for electronics cooling and thermal management applications are discussed.
Mechanical Engineering
Electronics Cooling Designs: Heat Pipes
Discussion on electronics cooling and thermal management using heat pipes in conjunction with heat sinks.
Engineering Automation
Discussion on Automation and the role played by mechanical engineers and electrical engineers utilizing tools such as CAD.
Engineering Energy: Hydroelectric
Discussing the engineering of hydroelectric energy and the roles played by mechanical engineers and electrical engineers using CAD and FEA as tools.
Engineering Energy: Wind
Mehanical engineers along with Electrical engineers use CAD and FEA to help design better and more efficient designs in the wind energy field.
Engineering Energy: Solar
Mechanical engineers work on solar energy design using CAD and FEA as tools to relieve environmental impacts.
Engineering Energy: Geothermal
Basic understanding of geothermal energy and design and the mechanical engineers role.
Engineering Technology Semicon West 2012
An overview of the Semicon West 2012 expo discussing semiconductor technology, engineering and solar engineering.
Elements of the Right Engineering Firm
Engineering firms and how a complete team is utilized in 21st century industry.
Computer Aided Engineering Methods
FEA, CAD, and CFD are discussed in relation to computer aided engineering and their benefits.
Engineering Tools in the 21st Century Part 4: CAD to CAM
CAD / CAM process and software within the mechanical engineering field is discussed.
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Engineering Tools in the 21st Century Part 3: CAD 2D to 3D
Computer Aided Design Features Examined
A licensed mechanical engineer, electrical engineer, as well as the other disciplines in the engineering fiel
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Engineering Tools in the 21st Century Part 2: CAD explored
CAD Modeling software used by mechanical engineers in the engineering fields is discussed.
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Engineering Tools in the 21st Century Part 1: Utilizing CAD and FEA
Finite element analysis (FEA) and CAD are discussed as just a couple of the tools made available to Licensed Engineers today.
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Metal Core Printed Circuit Board: Part 2
Electronics cooling and thermal management is discussed in predicting temperature evolution in printed circuit boards and electronic devices.
Metal Core Printed Circuit Board:Part 1
Printed Circuit Boards with metal cores developed by SinkPAD are discussed for the thermal management solutions the provide
Fundamentals of Glass Fracturing
Discussion of the fundamentals of glass fracturing and the part Finite Elemental Analysis and Mechanical Engineering play in the analysis.
Electronics Cooling and Thermal Management: PCB Part 2
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
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IC Thermal Management Part 5 Thermal Interface Materials
IC thermal Management scenario where there is no integrated heat spreader and the chip is directly coupled to the heat sink.
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IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards
IC Thermal Management discussion regarding the heat sink and thermal interface materials.
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