Thermal Analysis of Espresso Cup Materials (Part 2)
A thermal analysis experiment of a Bodom tm insulated espresso cup.
Thermal Analysis of Espresso Cup Materials (Part 2) Read More »
A thermal analysis experiment of a Bodom tm insulated espresso cup.
Thermal Analysis of Espresso Cup Materials (Part 2) Read More »
[fusion_builder_container hundred_percent=”no” equal_height_columns=”no” menu_anchor=”” hide_on_mobile=”small-visibility,medium-visibility,large-visibility” class=”” id=”” background_color=”” background_image=”” background_position=”center center” background_repeat=”no-repeat” fade=”no” background_parallax=”none” parallax_speed=”0.3″ video_mp4=”” video_webm=”” video_ogv=”” video_url=”” video_aspect_ratio=”16:9″ video_loop=”yes” video_mute=”yes” overlay_color=”” video_preview_image=”” border_size=”” border_color=”” border_style=”solid” padding_top=”” padding_bottom=”” padding_left=”” padding_right=””][fusion_builder_row][fusion_builder_column type=”1_1″ layout=”1_1″ background_position=”left top” background_color=”” border_size=”” border_color=”” border_style=”solid” border_position=”all” spacing=”yes” background_image=”” background_repeat=”no-repeat” padding=”” margin_top=”0px” margin_bottom=”0px” class=”” id=”” animation_type=”” animation_speed=”0.3″ animation_direction=”left” hide_on_mobile=”small-visibility,medium-visibility,large-visibility” center_content=”no” last=”no” min_height=”” hover_type=”none” link=””][fusion_text] Thermal Analysis of Espresso Cup Materials In our blog this week focuses on espresso coffee and the material of the cup in which it is served. The three standard materials that will be tested are paper, Styrofoam and ceramic. Paper cups are designed
Thermal Analysis of Espresso Cup Materials (Part 1) Read More »
A study of the thermal engineering process that produces an espresso, and the thermal analysis that optimize the end result.
Discussing the engineering constraints, thermal management, and design ideas for chuck heaters used within the semiconductor process.
Thermal Management Engineering Designs: Semiconductor Chuck Heaters Read More »
This week in The Engineer’s Kitchen, we engineered a Panzanella Salad with Grilled Chicken as a summer lunch.
The Engineer’s Kitchen: Grill Style Panzanella Salad Read More »
A discussion of utilizing CFD and FEA to perform stress analysis and thermal analysis on turbines that acquire geothermal energy.
Alternative Energy Engineering: Energy from the Earth’s Natural Heat Read More »
Alternative energy opportunities and advances available utilizing Methane Gas for energy generation.
Discussing the engineering processes and advancements regarding semiconductors and semiconductor equipment.
Discussion on materials used in heat sinks and their thermal management properties used by engineers in today’s technology.
Continued discussion on engineering designs for thermal management in electronics cooling
Discussion on thermal interface materials used with heat sinks to achieve efficient thermal management solutions for electronics cooling
Electronics Cooling : Thermal Interface Materials Read More »
Electronics Cooling presenting synthetic jets. Part of a series on different types of electronics cooling and thermal management methods.
Engineering discussion on Electrostatic Fluid Accelerators (EFA) and their effects on electronics cooling and thermal management
Thermoelectric Plates used for thermal management in electronics cooling is discussed from an engineering prospective.
Electronics Cooling Designs: Thermoelectric Plates Read More »
Heat sinks for electronics cooling and thermal management applications are discussed.
Discussion on electronics cooling and thermal management using heat pipes in conjunction with heat sinks.
Discussing the engineering of hydroelectric energy and the roles played by mechanical engineers and electrical engineers using CAD and FEA as tools.
Basic understanding of geothermal energy and design and the mechanical engineers role.
Engineering firms and how a complete team is utilized in 21st century industry.
Electronics cooling and thermal management is discussed in predicting temperature evolution in printed circuit boards and electronic devices.