Metal Core Printed Circuit Board:Part 1
Printed Circuit Boards with metal cores developed by SinkPAD are discussed for the thermal management solutions the provide
Thermal Management
Fundamentals of Glass Fracturing
Discussion of the fundamentals of glass fracturing and the part Finite Elemental Analysis and Mechanical Engineering play in the analysis.
Electronics Cooling and Thermal Management: PCB Part 2
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
IC Thermal Management Part 5 Thermal Interface Materials
IC thermal Management scenario where there is no integrated heat spreader and the chip is directly coupled to the heat sink.
IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards
IC Thermal Management discussion regarding the heat sink and thermal interface materials.
LED: Second Level Connection Challenges
LED lighting and second level connection challenges as they pertain to thermal management and optimizing the thermal path.
Printed Circuit Boards Part 1: Printed Circuit Board Basics
Printed Circuit Board design information which include routing, electronics thermal management, SPICE models and more.
LED Lighting: Part 2, First Level Connection Challenges in LEDs
In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.
LED Lighting: “Daylight, Now in a Headlight”
LED lighting used in Audi’s Superbowl commercial showcased their headlights. Mechanical engineers address LED engineering issues, thermal management.
LED Lighting: Transitioning Away from Incandescent Lights
LED lighting technology allows us to move away from incandescent lights and towards more efficient lighting.
IC Thermal Management: Electronic Systems Reliability & AMP; Power Cycling
Thermal Management as it relates to electronics reliability due to power cycling and its place in semiconductor reliability.
IC Thermal Management Part 3: Underfill TG
IC thermal management, Hot Spots, and underfill glass transition temperature are discussed.
IC Thermal Management: Part 2, IC Package Heat Spreaders
IC Thermal Management discussion regarding heat transfer and heat spreaders.
IC Thermal Management: Part 1
IC thermal management, cooling and heat transfer, for electrical engineers and mechanical engineers.