Introduction to IC Thermal Management and Heat Transfer
IC thermal management introduction. This relates to the heat transfer problems encountered by an electrical engineer in semiconductor design.
Elements of the Right Engineering Firm
Engineering firms and how a complete team is utilized in 21st century industry.
Engineering Tools in the 21st Century Part 1: Utilizing CAD and FEA
Finite element analysis (FEA) and CAD are discussed as just a couple of the tools made available to Licensed Engineers today.
Electronics Cooling and Thermal Management: PCB Part 2
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
IC Thermal Management Part 5 Thermal Interface Materials
IC thermal Management scenario where there is no integrated heat spreader and the chip is directly coupled to the heat sink.
IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards
IC Thermal Management discussion regarding the heat sink and thermal interface materials.
Printed Circuit Boards Part 1: Printed Circuit Board Basics
Printed Circuit Board design information which include routing, electronics thermal management, SPICE models and more.
IC Thermal Management: Electronic Systems Reliability & AMP; Power Cycling
Thermal Management as it relates to electronics reliability due to power cycling and its place in semiconductor reliability.
IC Thermal Management Part 3: Underfill TG
IC thermal management, Hot Spots, and underfill glass transition temperature are discussed.
IC Thermal Management: Part 2, IC Package Heat Spreaders
IC Thermal Management discussion regarding heat transfer and heat spreaders.
IC Thermal Management: Part 1
IC thermal management, cooling and heat transfer, for electrical engineers and mechanical engineers.