Metal Core Printed Circuit Board: Part 2
Electronics cooling and thermal management is discussed in predicting temperature evolution in printed circuit boards and electronic devices.
Metal Core Printed Circuit Board:Part 1
Printed Circuit Boards with metal cores developed by SinkPAD are discussed for the thermal management solutions the provide
Fundamentals of Glass Fracturing
Discussion of the fundamentals of glass fracturing and the part Finite Elemental Analysis and Mechanical Engineering play in the analysis.
Electronics Cooling and Thermal Management: PCB Part 2
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
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IC Thermal Management Part 5 Thermal Interface Materials
IC thermal Management scenario where there is no integrated heat spreader and the chip is directly coupled to the heat sink.
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IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards
IC Thermal Management discussion regarding the heat sink and thermal interface materials.
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LED: Second Level Connection Challenges
LED lighting and second level connection challenges as they pertain to thermal management and optimizing the thermal path.
Printed Circuit Boards Part 1: Printed Circuit Board Basics
Printed Circuit Board design information which include routing, electronics thermal management, SPICE models and more.
Printed Circuit Boards Part 1: Printed Circuit Board Basics Read More »
What to Look For In A Licensed Mechanical Engineer
Some key attributes of a licensed mechanical engineer that one should consider before engaging with the professional engineer.
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Advantages of Using Licensed Mechanical Engineer
Mechanical engineers play a great role in the manufacturing process. Companies seek the services of licensed mechanical engineering
Advantages of Using Licensed Mechanical Engineer Read More »
LED Lighting: Part 2, First Level Connection Challenges in LEDs
In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.
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LED Lighting: “Daylight, Now in a Headlight”
LED lighting used in Audi’s Superbowl commercial showcased their headlights. Mechanical engineers address LED engineering issues, thermal management.
Optomechanical Engineering: Benefits of Finite Element Analysis
Optomechanical engineers, using finite element analysis, FEA, can address issues with thermal management, shock and vibration.
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Mechanical Engineering For The Stars: Atmospheric Challenges
optomechanical engineers are like mechanical engineers to the stars by developing active optics and actuators for ground based telescopes
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LED Lighting: Transitioning Away from Incandescent Lights
LED lighting technology allows us to move away from incandescent lights and towards more efficient lighting.
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Optomechanical Engineering Considerations for Space Instruments
Optomechanical engineering, material science, and environmental considerations and their importance in optical instruments related to space vehicles.
Optomechanical Engineering Considerations for Space Instruments Read More »
IC Thermal Management: Electronic Systems Reliability & AMP; Power Cycling
Thermal Management as it relates to electronics reliability due to power cycling and its place in semiconductor reliability.
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IC Thermal Management Part 3: Underfill TG
IC thermal management, Hot Spots, and underfill glass transition temperature are discussed.
IC Thermal Management: Part 2, IC Package Heat Spreaders
IC Thermal Management discussion regarding heat transfer and heat spreaders.
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