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Finite Element Analysis Results of a Semiconductor Chamber

Finite Element Analysis Results of a Semiconductor Chamber

The chamber analysis below is for a chamber in excess of 700 C. The dominant heat transfer mechanism is radiation. There are channels with cooling water, and o-rings to seal the vacuum chamber. The cooling fluid must be kept from excessing heat, otherwise it will over pressurize the chamber and other problems will occur in the cooling loop. The o-rings are elastomer, and can't be subjected to excessive heat. The analysis must show how hot certain parts of the chamber become.

The chamber

Finite Element Analysis, FEA Experts, Glew EngineeringFigure 1: Chamber blow out.

 

Finite Element Analysis Experts, Glew EngineeringFigure 2: Chamber section view.

FEA as virtual laboratory 

FEA analysis results of a semiconductor chamber before cooling channel revision. The analysis showed temperatures are too high for the material to withstand the conditions. A redesign and subsequent FEA analysis showed that the thermal objectives could be achieved.

FEA for Semiconductor Chamber, Glew Engineering

Figure 3: Chamber Thermal Results

Engineering and Litigation Projects

The Glew Engineering Consulting team has assisted in numerous engineering and litigation projects for many clients.  Nearly all are confidential and can't be disclosed due to non disclosure agreements and protective orders.  However, we have one example below, and hope to have more available later.

Finite Element

Decades of work in electronics, materials science, mechanical machinery, and semiconductor technology has provided Glew consultants not only with a depth of knowledge and advanced technical skills, but also with valuable experience that they utilize every case. We also provide advanced modeling and finite element analysis capabilities for all applications.

Below is a representative project:

Thermal Analysis of a Semiconductor Chamber by Finite Element Analysis: Conduction, Convection and Radiation