Finite Element Experts
At Glew Engineering Consulting, our team has expertise in CAD and finite element analysis (FEA) modeling, as well as elite abilities in stress analysis, radiation, and multiphysics modeling. We have special expertise in semiconductor equipment and high tech processing equipment, but are also happy to engage in FEA projects in support of other industries, such as sports equipment, consumer electronics, and medical devices. Additionally, we can help you with general structural, thermal, and flow (CFD) problems. With our multiphysics capabilit, we can analyze transient radiation effects, combined with fluid flow, and stress, simultaneously, to yield a virutal model of your device or product.
We offer the following types of FEA: Linear Static Stress, Linear Contact, Parametric / Optimization, Natural Frequency (Modal), Motion Dynamics, Response Spectrum, Random Vibration, Frequency Response, Transient Stress, Critical Buckling Load, Dynamic Design Analysis Method, Rigid-Body Motion, Flexible-Body Motion, Nonlinear Contact, Nonlinear Materials, Geometric Nonlinearities, Nonlinear Buckling, Steady-State Heat Transfer, Transient Heat Transfer, Steady Fluid Flow, Unsteady Fluid Flow, Flow Through Porous Media, Open-Channel Flow, Mass Transfer, Fluid and Thermal Analysis, Thermal Stress, Fluid and Structural Analysis, Electrostatics, Joule Heating, and Electromechanical.
FEA Applied to Semiconductor Equipment
Among our specialties are Semiconductor technology, process tools and chambers, and hold extensive knowledge in the design, manufacturing, and implementation of these machineries. Requiring extreme conditions, high precision, and advanced materials, semiconductor process chambers must be built to specifications sufficient to function safely for the people working around the chamber, as well as for the protection of the equipment itself.
FEA allows for comprehensive modeling of the chamber’s integrity during testing conditions. The FEA model serves as a virtual experiment that allows reduction in prototype cost and testing. An accurate model can reduce the costly repercussions of an incorrectly designed system. Not only does the FEA model provide a useful tool in validating a design, but it can also provide a platform for motivating design improvements and innovations once the product has graduated from beta phase and even after the product is released to market. FEA can help with continuous improvement, as well as the next generation or innovation.
Specifically in the design of a semiconductor chamber, FEA can be done to test the structural stability of the quartz dome cover, and test the conduction, convection, and radiation of heat throughout the chamber when operating temperatures are reached. Cooling channels inserted in the stainless steel body and clamp ring can be iteratively designed to optimize the cooling of the system to safe conditions for all materials. One particular point of failure that can occur is at the interface with o-rings securing the quartz dome within its stainless steel frame. With a steady-state temperature analysis, the conditions at the points along the o-ring can be investigated precisely, and recommendations can be made for modification of the design.
In addition to normal operation, emergency situations must be accounted for in the safe design of a semiconductor chamber. Transient temperature analysis can be performed to understand how the system behaves in case of an emergency power shutdown, when chamber cooling may be significantly reduced, increasing the risk of heat damage to the system.
AutoDesk Simulation Professional (Formerly Algor)
Our main software tools include full multiphysics Autodesk Simulation (Algor) (TM), Inventor (TM), and Mathematica (TM).
Semiconductor Chamber Blown Out
Blown out view of the semiconductor chamber parts
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Semiconductor Chamber Pre Revision
FEA analysis results of a semiconductor chamber before cooling channel revision. The analysis shows temperatures are too high for the o-ring material to withstand the thermal conditions.
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Semiconductor Chamber Post Revision
FEA analysis results of a chamber post cooling channel revision. The material temperatures have been reduced to safe operational limits.
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