Recent Posts

Friday, Oct 24, 2014
Monday, Oct 13, 2014
Monday, Oct 6, 2014
Saturday, Sep 27, 2014
Friday, Sep 19, 2014
Saturday, Sep 13, 2014
Friday, Sep 5, 2014
Tuesday, Aug 26, 2014
Thursday, Aug 21, 2014
Monday, Aug 4, 2014
Wednesday, Jul 9, 2014
Wednesday, Jul 2, 2014
Wednesday, Jun 25, 2014
Friday, Jun 20, 2014
Friday, Jun 13, 2014
Friday, Jun 6, 2014
Wednesday, Jun 4, 2014
Friday, May 30, 2014
Friday, May 23, 2014
Friday, May 16, 2014
Friday, May 9, 2014
Thursday, May 8, 2014
Friday, May 2, 2014
Thursday, May 1, 2014
Thursday, Apr 17, 2014

Subscribe by Email

Your email:


Current Articles | RSS Feed RSS Feed

Semiconductor Plasma Processing


A plasma is a gas in which some electrons have been stripped away from some atoms to create positively charged ions and negatively charged electrons. Semiconductor Plasma Processing, Glew EngineeringElectric and magnetic fields are used to create plasmas and to control their behavior.  Two early uses of plasma in semiconductor processing are sputtering and photoresist striping.  In sputtering, a plasma is created with inert gas atoms, such as argon, and the argon ions are accelerated onto a target surface at high energy.  The collisions knock target atoms off the surface, and at the low pressures involved, the freed target atoms travel by line of sight to the substrate.  In photoresist stripping, the primary gas is oxygen. When oxygen is excited in the plasma, the resulting oxygen ions are extremely reactive with organic materials.  Photoresist residue from photolithography processing is primarily organic chemicals, and the oxygen ions react with the residue to form volatile carbon dioxide. 

Today, a major use of plasma is in plasma dry etching.  Until the 1970s, patterns were generally created in thin films by wet etching processes.  As feature sizes became too small to control with wet etching, plasma etching was introduced.  Plasma etching provided the additional advantage that the nature of the etched sidewall could be controlled from generally rounded   (isotropic etching) to sloped to essentially vertical (anisotropic etching). 

Another application is plasma-enhanced chemical vapor deposition (PECVD or plasma CVD).  In normal CVD, thermal energy at the substrate surface causes chemical reactions to occur there that result in deposition.  When a plasma is used, some of the chemicals in the gas phase are stimulated or excited so that they are more reactive when they contact the heated substrate surface.  As a result, higher growth rates can be achieved at lower temperatures than would be possible without the plasma. 

For more information, contact Glew Engineering Consulting Glew Engineering provides technical consulting to the semiconductor industry as well as patent litigation and trade secret expert witnesses. 

For more information on Glew Engineering Consulting visit the Glew Engineering website, blog or call 800-877-5892 or 650-641-3019. 


There are no comments on this article.
Comments have been closed for this article.

Current Articles | RSS Feed RSS Feed

Linear v Novellus (Semiconductor Equipment)


After 8 long years, Novellus finally rid itself of the lawsuit with Linear Technology. Irell and Manella LLP, for whom Glew Engineering has worked in the past, took no prisoners in the unanimous jury verdict announced yesterday in favor of their client Novellus.  The jury consisted of 12 men and women in Santa Clara, CA, the heart of the silicon valley.  Certainly good news for Novellus' legal team, as well as their bottom line. Congratulation to Jonathan Kagan Esq. and his colleagues.  Now both sides can get back to what they do best - making chips and chip equipment.

Novellus' also shipped their 1000th Vector PECVD tool in February? Considering the tool's throughput and uptime, there may be as many chips out there by now with Novellus' dielectric films as those of any semiconductor equipment manufacturer. See the details at:


Semiconductor Equipment, Glew Engineering

All Posts

Follow Glew Engineering

Browse by Tag

Subscribe by Email

Your email: