Dr. Maxat Touzelbaev, Chief Technical Officer
Dr. Maxat Touzelbaev has over 10 years experience in thermal design optimization and characterization. He has worked as a packaging engineer primarily in the semiconductor industry. He has strong analytic and management skills in the areas of thermal packaging and power cycling. He is a visiting researcher and graduate student co-advisor for the Mechanical Engineering department at Stanford University. His language skills include fluency in English and Russian.
Thermal and Power Management Experience
Dr. Touzelbaev helped pioneer the use of indium in IC thermal management. He has worked on real time device temperature predictions and estimates. He continues to actively develop technology in this area.
Semiconductor Packaging Experience
He has managed the thermal and electrical packaging characterization efforts at a major CPU manufacturer. His work included quality assurance (QA) of semiconductor packages using time domain reflection (TDR) characterization techniques in concert with thermal impedance modeling. Power delivery and removal via semiconductor packages to the silicon and substrates continue to present significant challenges to the IC, MEMS, LED and related industries.
Thermal Metrology Experience
He has designed back-end temperature controllers for characterization for devices under test (DUT). Tens of thousands of installed units that he designed continue to be used in device manufacturing. He also pioneered the use of frequency domain thermal characterization techniques to supplement existing time domain techniques for improved accuracy.
Micro/Nano Scale Transport Experience
Dr. Touzelbaev has extensive theoretical and experimental background in sub-continuum energy transport, relevant for at least thin films and nanostructures. During his dissertation at Stanford, he studied thermal transport in thin diamond and diamond-like films as well as confinement structures, such as super lattices.
Patents
Dr. Touzelbaev has five patents issued in the field of semiconductor packaging and seven patents currently pending.
Publications
Dr. Touzelbaev currently has 24 technical publications and a book chapter.
Education
Dr. Touzelbaev holds a Ph.D in Mechanical Engineering from Stanford University, He received his M.S in Mechanical Engineering from the University of Arkansas.